Print&Play: WOSP hardware for optical thin film analysis

Wednesday, May 3, 2017: 3:20 PM
Exhibit Hall (Rhode Island Convention Center)
Dr. Wolfgang Theiss , W.Theiss Hard- and Software, Aachen, Germany
A new method to build optical thin film analysis equipment will be presented. We combine excellent spectrometers with 3D printed mechanical parts and a newly designed light source. This way we produce – in a very flexible way - affordable measurement systems recording high quality spectra. We will show a desktop system (for use in the lab) measuring absolute reflectance and transmittance spectra at various angles. In addition, we will present results of a scanning traverse system for large area coaters which are of the same quality as those of very expensive research instruments. An integrating sphere solution for inline inspection of textured solar glass has been developed as well.

All devices are controlled by a new version of our CODE thin film analysis and design software. CODE has been equipped with powerful scripting features to control various hardware components like spectrometers, stepper motors, servo motors and sensors. Measurements can be triggered by external signals using an integrated OPC client. Data transfer to our powerful production control software BREIN is built in as well.