target bo backing-plate direct thermal and electrical contact

Sputtering pads with initial thickness of 1.5 mm and 99.95 % purity packed under vacuum used to compensate the mechanical stress of the target. The pad thickness after clamping is 0.2 to 0.5 mm and is a direct replacement of Indium foils, metallic brazing or silver bonding for clamped targets. The electrical conductivity and thermal transfer are the ones of Copper metal. These pads can be up to several meters long and 200 mm wide.