Alloy Cu Films with Improved Characteristics for Electronic Applications
Alloy Cu Films with Improved Characteristics for Electronic Applications
Tuesday, May 2, 2017
Copper is widely used in microelectronic devices for its low manufacturing cost and high electronic conductivity.
Flat Panel Display industries, in particular, requires for low resistance material for fast pixel switching response in large screen TVs and lower energy consumption in mobile devices. Advantage of high conductivity copper in electronic devices is offset by some disadvantages of poor adhesion to glass/Si and low stability in humid environment. New copper alloys were subsequently evaluated for use as a cap and barrier layer for metallic line and TFT electrodes.
A group of copper alloys were designed for increasing the corrosion resistance and adhesion to glass while also lowering reflectivity characteristics. Various copper alloys were created by depositing thin film with co-sputtering at different conditions. This study evaluated the variety of film compositions against the high temperature/humidity stability of the films over 40 days Trends of resistivity and changes in reflectivity were evaluated under high temperature oxidation vs. alloy composition.
Flat Panel Display industries, in particular, requires for low resistance material for fast pixel switching response in large screen TVs and lower energy consumption in mobile devices. Advantage of high conductivity copper in electronic devices is offset by some disadvantages of poor adhesion to glass/Si and low stability in humid environment. New copper alloys were subsequently evaluated for use as a cap and barrier layer for metallic line and TFT electrodes.
A group of copper alloys were designed for increasing the corrosion resistance and adhesion to glass while also lowering reflectivity characteristics. Various copper alloys were created by depositing thin film with co-sputtering at different conditions. This study evaluated the variety of film compositions against the high temperature/humidity stability of the films over 40 days Trends of resistivity and changes in reflectivity were evaluated under high temperature oxidation vs. alloy composition.