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Tuesday, April 25, 2006 - 2:30 PM
BSC11.4

Contribution to Soldering of Aluminum-Matrix-Composites and Other Methods Produced by ECAP

S. Muecklich, B. Wielage, I. M. Hoyer, T. Grund, TU Chemnitz, Chemnitz, Germany; H. Klose, WSH Zwickau, Zwickau, Germany

Only a few research groups focus their activities on the soldering/brazing of aluminum-matrix-composites (AMC). Especially high strength aluminum alloys, like the 7xxx series, have to accomplish with melting temperatures of solders.

The conventional brazing filler metals, like AlSi12, cannot be applied due to their too high melting temperatures. Merely zinc based solders exhibit work temperatures below 450 °C.

AMCs produced by ECAP (Equal Channel Angular Pressing) are known to show an extremely fine grained microstructure. This structure is prone to recristallize at high temperatures. Therefore Sn-based solders with a proven thermal stability are required. Reinforcements, like Al2O3 Particles, are assumed to increase the tensile strength and creep resistance.

Inherent to the Soldering Process with a mechanical activation of the surface is a very high potential for dedicated application in the areas of soldering of AMCs and AMCs with composites.

Selected experimental test results are going to be presented together with fields of high potential applications.