NanoBond® Assembly – A Rapid, Room Temperature Soldering Process

Indium Corporation of America has commercialized a new technology that will revolutionize how manufacturers join componentsusing solder materials. The joining process is based on the use of reactive multilayer foils as local heat sources. The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds are completed at room temperature in air, argon or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resistivityan order of magnitude lower, than current commercial TIMs.