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Solder Joining Methods

Monday, April 23, 2012: 10:00 AM-12:00 PM
Red Rock B (Red Rock Casino Resort and Spa)
Session Chair:
Dr. Ronald Smith
10:00 AM
Effect of Isothermal Aging on Sn-Ag-Cu Solder Joints on Electroless Ni-P/Au Plating in Laser Reflow Soldering
Dr. Hiroshi Nishikawa, Osaka University; Noriya Iwata, Osaka University; Tadashi Takemoto, Osaka University
10:20 AM
Accelerated Aging of Sn-Pb and Pb-Free Solder Joints on Hybrid Microcircuit Assemblies
Dr. Paul Thomas Vianco, Sandia National Laboratories; Alice Kilgo, Sandia National Laboratories; Estabab Guerrero, Honeywell Federal Manufacturing and Technologies
10:40 AM
Joining At Low Temperatures with Organic Silver Complexes
Dr. Annerose Oestreicher, Technische Universität Berlin; Mr. Tobias Röhrich, Technische Universität Berlin; Prof. Martin Lerch, Technische Universität Berlin
11:00 AM
Active Solder Joining Electrical Buss on Photovoltaic Cells
Dr. Ronald Smith, S-Bond Technologies; Dr. Pritpal Singh, Villanova University; Chris Darvell, Villanova University
11:20 AM
NanoBond® Assembly – A Rapid, Room Temperature Soldering Process
Mr. Jacques Matteau, Indium Corporation of America
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