Microstructure and Texture of High Formability QMet 300™ Copper Alloy

Tuesday, September 13, 2022: 8:40 AM
Convention Center: 262 (Ernest N. Morial Convention Center)
Ms. Rhea L. Christopherson , Materion Brush Performance Alloys & Composites, Elmore, OH
Ms. Carole L. Trybus , Materion Brush Performance Alloys & Composites, Elmore, OH
Mr. John C. Kuli , Materion Brush Performance Alloys & Composites, Elmore, OH
During 2020, Materion Corporation introduced a new electrical conductor alloy that exhibits greatly improved part formability compared to competing high strength (+ 500 MPa YS) and high conductivity (+ 80 %IACS) copper alloys. QMet 300 ™ typically exhibits sharp bends both good way and bad way. In order to understand the microstructural features of this improvement, an investigation was taken to measure the optical metallographic and textural features of QMet 300™ strip as compared to the features of similar competing alloy systems. EBSD textural analysis results reveal that the orientation is similar in both directions and that <111> and <110> predominate. It appears that QMet 300™ gets its good formability traits from large areas of closely aligned sub cells which enable deformation.
See more of: Microstructural Characterization II
See more of: Characterization of Materials and Microstructure through Metallography, Image Analysis, Machine Learning, and Mechanical Testing - Fundamental and Applied Studies