Innovative Decapsulation Methodology for Multi-Stacked Die Devices A Hybrid Laser and Chemical Approach

An optimized decapsulation methodology for three-level stacked die packages, addressing over-etching issues observed with conventional manual techniques. The proposed hybrid approach combines laser pre-cavitation with controlled acid etching, supported by a Design of Experiment (DOE) to determine optimal parameters. Implementation reduced acid exposure time by 98.9% and eliminated bond pad damage, improving wire pull test reliability. The process also enabled workload redistribution and achieved an annual cost avoidance of $3,474.