Cu Sinter Paste for Power Device and Advanced Device Packaging Applications

Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in high-power electronic device packaging due to its low material cost and excellent electrical and thermal conductivity. Additionally, fine-pitch copper (Cu) pillar interconnects have been widely adopted in flip-chip packaging to enable high-density integration. In this talk, recent research on low-temperature Cu sinter-joining technology will be reviewed, including its background, development, challenges, and future perspectives in high-power electronics. Furthermore, its applications in advanced packaging will also be summarized.