Micro and Nanojoining I

Monday, September 28, 2026: 9:00 AM-10:20 AM
304B (Québec City Convention Centre)
9:00 AM
Cu Sinter Paste for Power Device and Advanced Device Packaging Applications
Prof. Chuantong CHEN, The University of Osaka; Dr. Dongjin Kim, Korea Institute of Industrial Technology (KITECH)
9:20 AM
Metallic nanostructures as SERS substrates for chemical and biological sensing
Dr. Aristides Docoslis, Queen's University at Kingston; Dr. Hridaynath Bhattacharjee, Queen's University at Kingston
9:40 AM
Low Temperature Nano-Soldering on Electroplated Textiles for Wearable Electronics
Mr. Ileas Harb, University of Massachusetts Lowell; Mr. Daniel Liu, University of Massachusetts Lowell; Prof. Zhiyong Gu, University of Massachusetts Lowell
10:00 AM
High-strength NiTi-stainless steel joint fabricated via resistance microwelding
Dr. Kaiping Zhang, University of Waterloo; Dr. Peng Peng, University of Waterloo; Dr. Y. Norman Zhou, University of Waterloo
See more of: Joining of Advanced and Specialty Materials (JASM XXV), organized by the Joining of Advanced and Specialty Materials Programming Committee
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