Ion Beam Polishing for Embedded Cross-Sections and its Advantages for FESEM Analysis in Electronic Packaging
W. Mack, R. Fischer, B. Seidl, T. Ort, J. Walter, Infineon Technologies AG, Regensburg, Germany; W. Grünewald, BAL-TEC AG, Liechtenstein, Liechtenstein; M. Petzold, Fraunhofer Institut for Mechanics of Materials, Halle, Germany; L. Berthold, Fraunhofer Institute for Mechanics of Materials, Halle, Germany
