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| Session 18: Package Level Analysis 2 | ||||
| Location: Jr. Ballroom (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Surface-level die defects represent a significant portion of package level failure mechanisms. The imaginative means and ability to utilize new equipment for effective identification and isolation of these defects are presented in the papers of session 2. | ||||
| Editors: | Mr. Ted Hasegawa National Semiconductor, Santa Clara, CA Felix Beaudoin IBM Mr. Michael Eskenazi Qualcomm Corporation, San Diego, CA Mr. Stanley Swieck Analog Devices, Wilmington, MA James Cargo Agere Systems, Allentown, PA Mr. Ray D. Harrison Texas Instruments, Dallas, TX Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT | |||
| Session Chair: | Mr. Ray Harrison Texas Instruments, Dallas, TX | |||
| 8:00 AM | 18.1 | Use of Laser Milling Methods for Fault Isolation and Failure Analysis of Multiple Stacked die packages | ||
| 8:25 AM | 18.2 | Advanced Acoustic Micro Imaging Applications : Deciphering multiple acoustic echoes and reflections | ||
| 8:50 AM | 18.3 | Paper Withdrawn | ||
| 9:15 AM | 18.4 | Frequency Domain Imaging: Acoustic Microscopy Technique for Die Stacking Application | ||
| 9:40 AM | 18.5 | Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages | ||
| 10:05 AM | Break | |||