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| Session 21: System Level Analysis 2 | ||||
| Location: Jr. Ballroom (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: Papers in this session examine printed circuit board propagating exothermic faults, characterization and modeling of PCB thermal expansion for various copper laminates, and characterization of cracks in electroplated copper layers. | ||||
| Editors: | Mr. Ted Hasegawa National Semiconductor, Santa Clara, CA Felix Beaudoin IBM Mr. Michael Eskenazi Qualcomm Corporation, San Diego, CA Mr. Stanley Swieck Analog Devices, Wilmington, MA James Cargo Agere Systems, Allentown, PA Mr. Jeff Birdsley Dell, Round Rock, TX Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT | |||
| Session Chair: | Mr. Jeff Birdsley Dell, Round Rock, TX | |||
| 10:25 AM | 21.1 | Printed Circuit Board Propagating Faults | ||
| 10:50 AM | 21.2 | Materials Characterization and Model of PCB Thermal Expansion for Laminates with Various Copper Densities and Thicknesses | ||
| 11:15 AM | Lunch | |||