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| Packaging 2 | ||||
| Location: Meeting Room C/D (Worcester's Centrum Centre) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Editors: | Mr. David Vallett IBM Systems and Technology Group, Essex Jct., VT Dr. William Vanderlinde Laboratory for Physical Sciences, College Park, MD | |||
| Session Chair: | Ms. Becky Holdford Texas Instruments, Dallas, TX | |||
| 8:00 AM | PCB-SMT Assembly Failure Analysis | |||
| 10:00 AM | Break | |||
| 10:15 AM | Critical Issues using Lead-Free Technology | |||