A. Falk
OptoMetrix, Inc
Renton, WA
Session 10: Optical Techniques 1
Session 22: Optical Techniques 2
 

A. Erickson
Multiprobe, Inc.
Santa Barbara, CA
Session 17: SPM Techniques 2
 

A. Gattiker
IBM Corporation
Austin, TX
Session 4: Test 1
Session 28: Test 3
Session 9: Test 2
 

B. Tracy
Spansion, LCC
Sunnyvale, CA
Session 13: Metrology and Materials Analysis 1
Session 20: Metrology and Materials Analysis 2
Session 23: Metrology and Materials Analysis 3
 

C. Boye
IBM

Session 19: Yield Enhancement
 

D. J. Bodoh
Freescale Semiconductor
Austin, TX
Session 11: Panel Discussion
 

D. L. Barton
Sandia National Laboratories
Albuquerque, NM
Session 15: Optoelectronic Devices
 

D. Vallett
IBM Systems and Technology Group
Essex Jct., VT
Session 1: Nanotechnology
 

E. Keyes
Semiconductor Insights
Ottawa, ON, Canada
Session 16: Sample Preparation 1
Session 27: Sample Preparation 2
 

I. De Wolf
IMEC
Leuven, Belgium
Session 12: MEMS
 

J. Birdsley
Dell
Round Rock, TX
Session 14: System Level Analysis 1
Session 21: System Level Analysis 2
 

J. Colvin
FA Instruments
San Jose, CA
Session 10: Optical Techniques 1
 

K. Hooghan
Agere Systems
Allentown, PA
Session 26: Circuit Edit for FA, FI and Debug 2
 

P. Harris
Multiprobe, Inc
Santa Barbara, CA
Session 3: SPM Techniques 1
 

P. Perdu
CNES - French Space Agency
Toulouse, France
Session 6: Die Level Fault Isolation
 

R. Harrison
Texas Instruments
Dallas, TX
Session 5: Package Level Analysis 1
Session 18: Package Level Analysis 2
 

R. L. Alvis
Multiprobe, Inc.
Santa Barbara, CA
Session 24: SPM Techniques 3
 

T. Kolasa
Motorola SPS
Tempe, AZ
Poster
 

T. Myers
LSI Logic Corporation
Gresham, OR
Session 7: Failure Analysis Process 1
Session 25: Failure Analysis Process 2
 

Z. Wang
Intel Corporation
Chandler, AZ
Session 2: Advanced Techniques