B. Holdford
Texas Instruments
Dallas, TX Packaging 1 Packaging 2 |
C. Rue
FEI Company
Hillsboro, OR Yield Fault Isolation 2 |
C. Richardson
Abound Solar
Fort Collins, CO Microscopy Tools 2 Microscopy Tools 3 |
C. Furlong
Worcester Polytechnic Institute, WPI
Worcester, MA Microscopy Tools 3 |
J. Arnold
ASM International
Materials Park, OH Prize Drawing |
J. A. Walraven
Sandia National Labs
Albuquerque, NM MEMS |
K. S. Wills
Independent Consultant
Sugar Land, TX Failure Analysis Basics Packaging 1 Sample Preparation |
L. G. Henry
ESD-TLP Consulting & Testing
Fremont,, CA Failure Mechanisms |
R. Ring
SMSC Austin
Austin, TX Device and Test 1 Fault Isolation 1 |
S. Subramanian
Freescale Semiconductor, Inc.
Austin, TX Microscopy Tools 1 Microscopy Tools 2 Microscopy Tools 3 |
S. Li
Spansion Inc
Sunnyvale, CA Device and Test 1 Device and Test 2 |
T. Myers
ON Semiconductor
Gresham, OR Failure Analysis Laboratory Management |
V. Chowdhury
Altera Corp.
San Jose, CA Device and Test 3 |
W. Vanderlinde
Laboratory for Physical Sciences
College Park, MD Monte Carlo software tools for energy dispersive x-ray analysis Introduction Prize Drawing |