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Sunday, November 6, 2005 - 3:30 PM
GEN0518.1

Chip Access and Depackaging

O. Diaz de Leon, Texas Instruments, Stafford, TX; K. S. Wills, Independent Consultant, Sugar Land, TX

Physical access to the semiconductor device is vital to isolation. Techniques for gaining access to the device will presented. Techniques will cover mechanical, dry, and de-capsulation. For flip chip devices, delidding and lapping procedures will be described for the purpose of backside.