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Wednesday, November 15, 2006

Combine Nano-Probing Technique with Difference Analysis to Identify Non-Visual Failures

C. M. Shen, Taiwan Semiconductor Manufacture Company, Ltd., Taiwan, Hsin-Chu, Taiwan; T. C. Chuang, J. F. Chang, J. H. Chou, Taiwan Semiconductor Manufacture Company, Ltd., Tainan, Taiwan

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Summary: This paper is to present a novel methodology, which is accomplished by applying difference analysis to Nano-probing technique. And the deductive method was developed to focus on resolving invisible failure modes that could not be characterized by common parameter measuring of Nano-probing nor checking of junction behavior.