L. F. Wen, C. H. Chen, A. T. Chang, TSMC, Hsin Chu, Taiwan

Summary: The purpose of this paper is to present an electrical analysis skill of submicron technology metal fuse laser blown fail by C-AFM. In order to obtain correct I-V curve data without damaging the failure site, we propose a new method to preserve the fail blown fuses by using SOG coating, and drying etching method to reveal the metal for C-AFM measurement.