E. Marquez, Texas Intruments, Inc., Dallas, TX; T. To, D. Nguyen, Texas Instruments Inc., Dallas, TX

Summary: In this paper, two sample preparation techniques for Small Outline Package (SOP) will be presented. The first technique is for front side sample preparation. A new procedure on jet etching system decapsulator was developed specially for small outline package device. The encapsulant will be removed while preserving the integrity of the die, bond pads, bond wires and lead frame interconnects. In addition, we will show a method eliminate the needs for repackaging on backside sample preparation. Both techniques allows failure analyst to do both front side or backside analysis on any small package devices