ISTFA Home      Exposition      To Register      ASM Homepage
Back to "Session 9: Posters" Search
  Back to "Symposium" Search  Back to Main Search

Wednesday, November 15, 2006

Note on the Use of Principal Component Analysis ( PCA) and Clustering for the Analysis of Wafer Level ATPG Data

K. Ramanujachar, Intel Corporation, Chandler, AZ; S. Draksharam, Texas Instruments, Stafford, TX

View in WORD format

Summary: In this contribution we explore the use of Principal Component Analysis and hierarchical clustering in the analysis of wafer level ATPG ( automatic test pattern generation) failure data. The method outlined will enable the selection of representative samples for physical failure analysis (PFA) following fault isolation with automated scan based software tools like Fast scan or Tetramax.