S. T. I., C. Tung Hung, United Microelectronics Corporation, Hsinchu, Taiwan

Summary: This paper will provide an alternative methodology to deacp of Flip chip package type of semiconductor microelectronic device by manual method and chemical reaction of some acid. By the process can be used to consistently and accurately prepare of flip chip while reducing consumables usage and saving preparation time to increase sample throughput and improve surface finishes.