J. C. Lin, -. W. S. Wu, -. K. S. Chen, J. H. Yeh, Y. C. Hou, United Microelectronics Corporation, Hsin-Chu, Taiwan

Summary: Front-end implantation failure issue is always very difficult to do FA especially in full process wafers. This is because implantation failure at specific area is almost structure invisible by SEM and FIB inspections. With the help of plane-view stain technique, a fast preview at the suspected Well regions can be done by 30 sec’s plane-view stain and SEM plane-view check. This new developed technique can greatly shrink the FA cycle time and avoid the unnecessary job of specific SCM. Unlike traditional X-S stain, the difficulties of sample preparation at the specific site and precise stain time control can be completely eliminated. Besides, one Pt-coated film on X-S sample surface before SEM observation is unnecessary by using plane-view stain method.