F. Toth, Intel Corporation, Hillsboro, OR; G. F. Shade, Intel, Hillsboro, OR

Summary: Describes non-destructive solder joint analysis technique to detect mode "H" failures at the second level interconnect on PCB assemblies. The 3D Xray tomography method can relace destructive analysis techniques used up until now such as cross section analysis. Results of Xray data and destructive methods correlate 100%.