T. R. McDonald, Intel, Hillsboro, OR

Summary: With the increased use of crack are measurment and disbond type mapping metrologies, Manual pull tools have become a preffered quick method to separate board components. Since recording force curves is not typically required for this type of work, Engineers have turned to simple deivces that require little set up or expense to remove components. Tools such as flat head screw drivers, facbricated pry tools and cam lever devices have been used to accomplish separation. Some designs make contact with some solder joints, others apply removal force unevenly across the solder joints that could compromise data, and most present safety and ergonomic risk to the operator. The manual pull tool system introduced here, demonstrates a dramatic reduction of these concerns