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| Session 13: Chemical and Mechanical Sample Preparation | ||||
| Location: Ballroom B (Renaissance Austin Hotel) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: This session is devoted to innovative techniques for precision delayering of integrated circuits to locate fail sites or assess manufacturing quality and reliability. This year’s session has four papers covering a range of topics including: delayering the new generation of multi-IC stacked packages, improved technique to assess gold ball bond reliability, and location of package induced IC defect and improved solder joint delineation techniques for quality assurance. | ||||
| Editor: | Mr. Edward Keyes Semiconductor Insights, Ottawa, ON, Canada | |||
| Session Chair: | Mr. Edward Keyes Semiconductor Insights, Ottawa, ON, Canada | |||
| 8:00 AM | Back Side Die Preparation for Check of Backend Related Problems | |||
| 8:25 AM | Development of the Polishing Technique for the Observation of the Intermetallic Compound at Solder Joint | |||
| 8:50 AM | Enhancement Method to Improve the Accuracy of Inter-Metallic Area Inspection on the Bonding Pad through Chemical and Mechanical Removal Processes | |||