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Session 6: Panel Discussion
Location: Ballroom A (Renaissance Austin Hotel)
(Please check final room assignments on-site).
Session Description: Panel Moderators: J. A. Walraven, Sandia National Laboratories; M. Keim, Mentor Graphics Panel Members: L. Wagner, Texas Instruments; S. Venkataraman, Intel Corporation In this panel session, we will revisit the topic of integrating test, diagnosis and failure analysis. Advances in IC design, test structures and packaging have made test and diagnosis in the failure analysis laboratory increasingly complex. Both methods are needed to stimulate, identify, and localize electrical problems to aid in physical fault isolation. Previous methods addressing the integration of test, diagnosis and failure analysis have focused on logistics and infrastructure, and improvements in test and FA technology. Over the last few years, many tools and techniques have been developed for physical fault isolation. This panel will discuss what is currently being done to increase the accuracy of software-based fault identification and localization and address fault isolation of multi-die packages and mixed signal components.
Editor:	Mr. Jeremy A. Walraven Sandia National Labs, Albuquerque, NM
Session Chair:	Mr. Jeremy A. Walraven Sandia National Labs, Albuquerque, NM