A. Falk
OptoMetrix, Inc
Renton, WA
Session 16: Optical Fault Isolation
 

B. D. Schrag
Micro Magnetics, Inc.
Fall River, MA
Session 1: Advanced Techniques 1
Session 14: Advanced Techniques 2
 

B. Davis
AMD
Austin, TX
Session 17: Analytical Process
 

C. Boye
IBM

Session 15: Yield Analysis
 

D. L. Burgess
Accelerated Analysis
Half Moon Bay, CA
Session 8: Discretes, Passives, MEMS, and Optoelectronics
 

D. Goyal
Intel Corporation
Chandler, AZ
Session 7: Package Level Analysis 1
Session 18: Package Level Analysis 2
 

E. Keyes
Semiconductor Insights
Ottawa, ON, Canada
Session 13: Chemical and Mechanical Sample Preparation
 

J. J. Clement
Sandia National Laboratories
Albuquerque, NM
Session 11: Die Level Fault Isolation
 

J. Birdsley
Dell Inc.
ROUND ROCK, TX
Session 2: System Level Analysis
 

J. A. Walraven
Sandia National Labs
Albuquerque, NM
Session 6: Panel Discussion
 

M. Abramo
Independent Consultant
New York,
Session 4: Circuit Edit and Beam-based Sample Preparation
 

P. Kaszuba
IBM Microelectronics
Essex Junction, VT
Session 19: Nanotechnology and Nanoprobing
 

R. Dias
Intel Corporation
Chandler, AZ
Session 1: Advanced Techniques 1
Session 14: Advanced Techniques 2
 

R. Goruganthu
AMD
Austin, TX
Session 5: Scanning Probe Microscopy
 

R. (. Blanton
Carnegie Mellon University
Pittsburgh, PA
Session 3: Test and Diagnostics
 

R. Ring
SMSC Austin
Austin, TX
Session 9: Posters
 

S. Subramanian
Freescale Semiconductor, Inc.
Austin, TX
Session 10: Metrology and Materials Analysis 1
Session 12: Metrology and Materials Analysis 2
 

Z. Fu
Intel Corporation
Chandler, AZ
Session 7: Package Level Analysis 1
Session 18: Package Level Analysis 2