R. K. Jain, T. R. Lundquist, Q. S. Wong, Credence Systems Corp., Sunnyvale, CA; T. Malik, DCG Systems Inc., Fremont, CA

Summary: The IC community has often wondered about the effects of a backside circuit edit using a FIB on IC behavior. Reliability of silicon device structures, transistors and diodes, are investigated by monitoring intrinsic parameters before and after and though each step of the circuit modification.