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| Tuesday, November 6, 2007 | ||
| 10:00 AM-11:40 AM | ||
| 1 Session 1: Emerging Concepts | ||
| 1:30 PM-2:45 PM | ||
| 2 Session 2: Circuit Edit 1 | ||
| 3 Session 3: SPM Techniques | ||
| 3:05 PM-4:20 PM | ||
| 4 Session 4: Sample Preparation | ||
| 5 Session 5: Photon Based Techniques | ||
| Wednesday, November 7, 2007 | ||
| 10:20 AM-12:00 PM | ||
| 6 Session 7: Package and Assembly Level FA 1 | ||
| 10:20 AM-12:25 PM | ||
| 7 Session 6: In-line Metrology and Inspection | ||
| 1:45 PM-3:00 PM | ||
| 8 Session 8: Posters | ||
| 4:00 PM-5:15 PM | ||
| 9 Session 9: Package and Assembly Level FA 2 | ||
| 4:00 PM-5:40 PM | ||
| 10 Session 10: Nanoprobing | ||
| Thursday, November 8, 2007 | ||
| 9:50 AM-11:05 AM | ||
| 11 Session 11: Package and Assembly Level FA 3 | ||
| 12 Session 12: Failure Analysis Process 1 | ||
| 11:00 AM-1:05 PM | ||
| 13 Session 13: Yield Enhancement | ||
| 14 Session 14: System Level Analysis and Test | ||
| 2:00 PM-3:15 PM | ||
| 15 Session 15: Circuit Edit 2 | ||
| 2:00 PM-3:40 PM | ||
| 16 Session 16: Failure Analysis Process 2 | ||