The appropriate use of Materials Analysis often plays the key role in the understanding electronic device attributes and failure. The important phrase in this sentence is “appropriate use” as the list of available analysis techniques is large. This session will provide a basic understanding of several specific materials analysis techniques used by failure analysts and relied upon by the semiconductor manufacturing community. Primarily through the use of case studies emphasis will be on both capability and limitations. Specifically the following techniques will be addressed. • Energy Dispersive Spectroscopy • Auger Electron Spectroscopy • Magnetic Sector and Quadrupole based Secondary Ion Mass Spectrometry (SIMS) • Fourier Transform Infrared Spectroscopy • Pyrolysis/Gas Chromatography/Mass Spectrometry