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| Sunday, November 4, 2007 | ||
| 8:15 AM-10:15 AM | ||
| Materials Characterization | ||
| 8:15 AM-12:00 PM | ||
| FA Basics | ||
| 8:15 AM-2:45 PM | ||
| Packaging | ||
| 10:30 AM-2:30 PM | ||
| FIB | ||
| 1:00 PM-6:45 PM | ||
| Microscopy Tools | ||
| 2:30 PM-3:45 PM | ||
| Lead Free Packaging | ||
| 2:45 PM-6:45 PM | ||
| Device and Memory FA | ||
| 4:00 PM-5:30 PM | ||
| Failure Mechanisms | ||
| 5:30 PM-6:45 PM | ||
| Emerging Technologies | ||
| Monday, November 5, 2007 | ||
| 8:00 AM-11:15 AM | ||
| EOS/ESD | ||
| 8:00 AM-4:15 PM | ||
| Test and Logic Diagnostics | ||
| 8:00 AM-6:15 PM | ||
| Fault Isolation | ||
| 11:15 AM-3:00 PM | ||
| MEMS Devices | ||
| 3:15 PM-5:15 PM | ||
| Analog Device Failure Analysis | ||
| 4:15 PM-6:15 PM | ||
| Lab Management | ||
| 5:15 PM-6:15 PM | ||
| Yield | ||