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| Session 4: Sample Preparation | ||||
| Location: Meeting Room J1-J2 (San Jose McEnery Convention Center) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Mr. Andrew Saxonis Analog Devices, Wilmington, MA | |||
| 3:05 PM | Backside 3D Analysis of Power Device Using an ITO Electrode | |||
| 3:30 PM | Re-Thin a TEM Lamella by Using a Novel TEM Sample Preparation | |||
| 3:55 PM | Applications for Parallel Grinding as an Alternative to Chemical Decapsulation in Preparing Packaged Samples for Failure Analysis | |||