A. Falk
OptoMetrix, Inc
Renton, WA
Session 5: Photon Based Techniques
 

A. Saxonis
Analog Devices
Wilmington, MA
Session 4: Sample Preparation
 

C. Boye
IBM

Session 13: Yield Enhancement
 

C. Boit
TUB Berlin University of Technology
Berlin, Germany
Session 1: Emerging Concepts
 

D. L. Burgess
Accelerated Analysis
Half Moon Bay, CA
Session 12: Failure Analysis Process 1
Session 16: Failure Analysis Process 2
 

D. Goyal
Intel Corporation
Chandler, AZ
Session 9: Package and Assembly Level FA 2
Session 7: Package and Assembly Level FA 1
Session 11: Package and Assembly Level FA 3
 

J. Demarest
IBM
Poughkeepsie, NY
Session 1: Emerging Concepts
 

J. Teshima
FEI Company
Hillsboro, OR
Session 6: In-line Metrology and Inspection
 

J. Colvin
FA Instruments
San Jose, CA
Session 3: SPM Techniques
 

K. S. Wills
Independent Consultant
Sugar Land, TX
Session 8: Posters
 

M. Abramo
Independent Consultant
New York,
Session 2: Circuit Edit 1
Session 15: Circuit Edit 2
 

M. W. Phaneuf
Fibics Incorporated
Ottawa, ON, Canada
Session 2: Circuit Edit 1
Session 15: Circuit Edit 2
 

M. Lane
Intel Corporation
Hillsboro, OR
Session 14: System Level Analysis and Test
 

P. Kaszuba
IBM Microelectronics
Essex Junction, VT
Session 10: Nanoprobing
 

R. Goruganthu
AMD
Sunnyvale, CA
Session 3: SPM Techniques
 

R. Chanpura
Texas Instruments
Stafford, TX
Session 8: Posters
 

S. Decker
South Dakota School of Mines
Rapid City, SD
Session 10: Nanoprobing
 

S. Ippolito
IBM
Yorktown Heights, NY
Session 5: Photon Based Techniques
 

W. E. Vanderlinde
Laboratory for Physical Sciences
College Park, MD
Session 10: Nanoprobing
 

Z. Fu
Intel Corporation
Chandler, AZ
Session 9: Package and Assembly Level FA 2
Session 7: Package and Assembly Level FA 1
Session 11: Package and Assembly Level FA 3