P. Jacob, EMPA Swiss Federal Laboratories for Materials Testing and Research, Duebendorf, Switzerland; M. Ruetsch, Vossloh Kiepe GmbH, Duesseldorf, Germany

Summary: Lead-free soldering applies at higher temperatures, which becomes critcal for some optoelectronic devices due to their lower melting point of transparent mold. During soldering, external pins relax their mechanical tension of being plugged into breadboard-PCBs by slight movements, thus shearing stitchbonds or making them sensitive to vibration. To enhance reliability, the stitch bonding meeds to be improved