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Session 2: Package and Assembly Level FA I
Location: Portland Ballroom 254 (Oregon Convention Center )
(Please check final room assignments on-site).
Session Description: Package and assembly level FA

Session Chairs:Dr. Deepak Goyal Intel Corporation, Chandler, AZ
Ms Zezhong Fu Intel Corporation, Chandler, AZ
12:20 PM New Developments in High-Resolution X-Ray Computed Tomography for Non-Destructive Defect Detection in Next Generation Package Technologies
12:45 PM Flip-chip bump interface failure mechanisms in plastic BGA packages and failure analysis process flow
1:10 PM PCB Pad Cratering - Characterization Techniques and Challenges
1:35 PM Break
1:45 PM Stitch-bond-shearing in optoelectronic devices, caused by lead-free-wave-soldering - do we need improved wire-bonding methods?
2:10 PM LEAD FREE SOLDER - GOLD METALLIZATION INTERDIFFUSION IN ELECTRONIC INTERCONNECTS - Challenges and their Control
2:35 PM Investigation into failure modes of thick film power resistors
3:00 PM Break