C. H. Wang, S. W. Lai, C. Y. Wu, B. T. Chen, J. Y. Chiou, J. H. Chou, Taiwan Semiconductor Manufacture Company, Ltd., Taiwan, Tainan, Taiwan

Summary: Many process parameters affect the device behaviour and cause the front-end defect. Simply, the failure are two types: high-resistance and leakage, especially the leakage mode defect is difficult to inspect. Although conductive atomic force microscopy and six probes nano-probing are popular tools for front-end failure inspection, some specific defects still need more effort. We will demonstrate the electrical phenomenon and analysis of crystalline defect.