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Session 10: Posters
Location: Exhibit Hall E (Oregon Convention Center )
(Please check final room assignments on-site).
Session Description: Posters

Session Chairs:Mr. Scott Wills Independent Consultant, Sugar Land, TX
Ms. Reena Chanpura Texas Instruments, Stafford, TX
 Novel Sample Preparation Technique for Backside Analysis of Singulated Die
 The failure analysis of specific source-to-drain dislocation and case study
 Next Generation Laser Voltage Probing
 A study of photoelectric effect caused by laser beam used for beam bounce technique in a C-AFM system
 Applications of C-AFM and CBED techniques to the characterization of substrate dislocations causing SRAM soft single column failure contained in a wafer with (001) plane/[100] notch
 Electroluminescence analysis by precise tilt polish technique of edge-emitting laser diode
 A Novel OBIRCH Failure Localization for Leakage fail in Flash Product Failure Analysis
 Case study of high temperature failure analyses using an on-chip “heater”
 Development of PECS Application for Sample Preparation
 Automated Sample Preparation of Packaged Microelectronics for FESEM
 Studies of fluorine-induced corrosion and defects on microchip Al bondpads and elimination solutions
 Optimization of SEM analytical conditions for low K and ultra low K dielectric materials
 Using cross-triggering in oscilloscope for debugging multiphase converter circuit of Personal Computer (PC) motherboard
 Doping Profile Measurements in a 65-nm Commercial Product using Atom Probe Tomography
 Failure Analysis of Nitride-Trapping Memory Cell Failures
 Advanced Methodologies for Backside Circuit Edit
 Physical Failure Analysis Techniques using 3D Rotation Imaging Method by STEM
 High Precision Ion Beam Milling with Time of Flight Compensation
 Applications of in-situ sample preparation and modeling of SEM-STEM imaging
 Sample Preparation Technique for Bond Pad Oxide Damage Observation