D. W. Niles, J. Meyer, R. W. Kee, Avago Technologies, Fort Collins, CO; M. DiBattista, FEI Corporation, Hillsboro, OR

Summary: Avago and FEI have collaborated to study and measure the resistances of multiple W vias deposited by a FIB, using a unique wafer thin-film structure. We will present the measured resistances compared to a classical model.