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| Session 5: Circuit-Edit | ||||
| Location: Meeting Room E145 (Oregon Convention Center ) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Mr. Kultaransingh (Bobby) Hooghan FEI KAUST, Saudi Arabia Mr. Steven Herschbein IBM Systems & Technology, Hopewell Junction, NY | |||
| 3:10 PM | Manufacturing In-Line Whole Wafer Focused Ion Beam (FIB) Memory Address Descramble Verification | |||
| 3:35 PM | An Analysis of Tungsten FIB-made Via Resistance | |||
| 4:00 PM | Backside Circuit Edit on Full-Thickness Silicon Devices | |||
| 4:25 PM | Break | |||
| 4:35 PM | Insulator Deposition for Through Conductor Editing | |||
| 5:00 PM | Creation of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Backside Editing Techniques | |||
| 5:25 PM | Break | |||