C. Rue, K. Skinner, R. Hoelle, FEI Company, Hillsboro, OR; S. B. Herschbein, C. Scrudato, IBM Systems & Technology, Hopewell Junction, NY

Summary: The feasibility of performing backside circuit edit on unthinned die is examined, with special attention to IR imaging, silicon trenching, and high-accuracy navigation within the trench.