T. Pendleton, RFMD, Greensboro, NC; L. Hunter, S. Lau, Xradia, Inc., Concord, CA

Summary: We report an non invasive failure analysis (FA) technique, in 3D of passive devices in wireless modules using a MicroCT (x-ray microtomography system). While the price of passive devices may not be significant, they are integrated into more expensive modules and circuits in wireless devices, which impacts reliability. Major FA problems in these passive devices include solder reflow, open solder connections and/or interconnect related defects, which cannot be easily detected with conventional techniques, such as 2D X-ray analysis, can now be characterized non invasive in 3D and 2D CT slices.