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Session 4: Package and Assembly Level FA II
Location: Portland Ballroom 254 (Oregon Convention Center )
(Please check final room assignments on-site).
Session Description:
Session Chairs:	Dr. Deepak Goyal Intel Corporation, Chandler, AZ Ms Zezhong Fu Intel Corporation, Chandler, AZ
3:10 PM			Non invasive Failure Analysis of Passive Electronic Devices in Wireless Modules using X-ray microtomography (MicroCT)
3:35 PM			Scanning Acoustic Microscopy for Solder Joint Failure Analysis and Design Improvements
4:00 PM			Application of Lock-In-Thermography for three-dimensional localisation of electrical defects inside of complex packaged devices
4:25 PM			Break
4:35 PM			An analytical technique to assess the risk of laser damage to encapsulated Integrated circuits during package laser marking
5:00 PM			Techniques for identification of silver migration in plastic encapsulated devices assembled with molding compound containing red phosphorus flame retardant material
5:25 PM			Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components
5:50 PM			Break