K. A. Mohammad, L. J. Liu, S. F. Liew, S. F. Chong, D. G. Lee, S. F. Lee, B. C. Lee, X-FAB SARAWAK SDN. BHD., Kuching, Malaysia

Summary: The paper focus on pad contamination defect and removal technique. EDX and SEM employed to analyse the defect. Hit rate is 60% detected at outgoing inspection step. Fluorine based contamination source and contributor is discussed. Rework technique employed chemical solvent dipping time split and dry plasma etch. Successful criteria is passing e-test, e-sort and reliability test.