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| Session 16: Yield Enhancement | ||||
| Location: Meeting Room E145 (Oregon Convention Center ) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chairs: | Dr. Sarma Gunturi Texas Instruments, Inc., Dallas, TX Cathy Kardach DCG Systems Inc, Fremont, CA | |||
| 9:40 AM | Oxidation of TiN ARC Layer as a Reliability Issue for ICs | |||
| 10:05 AM | Timing problems due to spacer bridging in a sub-100 nm product | |||
| 10:30 AM | A study of pad contamination defect and removal | |||
| 10:55 AM | A study to remove heavy polymer remain on thick metal (> 3 micron) sidewall profile after metal etch solvent clean step | |||
| 11:20 AM | Yield enhancement using a combination of wafer level Failure Analysis and defect isolation software: case studies | |||
| 11:45 AM | Lunch (attendees on their own) | |||