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Wednesday, November 5, 2008
Automated Sample Preparation of Packaged Microelectronics for FESEM
R. R. Cerchiara, P. E. Fischione, M. F. Boccabella, A. C. Robins, E.A. Fischione Instruments, Inc., Export, PA
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Summary:
Automated sample preparation of packaged devices is done using a combination of mechanical, ion and plasma based techniques.