T. Malik, R. Jain, DCG Systems Inc., Fremont, CA; T. Lundquist, DCG Systems, Fremont, CA

Summary: Contacting signals inside an integrated circuit (IC) is critical to debug new devices. Current flip chip circuit edit techniques are limited to spot resolution and chemistry constrains of the Focused Ion Beam (FIB) system. The new proposed technique uses a FIB circuit edit tool to contact signals at transistor level. The device is prepared using global silicon thinning and polishing tool with low risk of device performance degradation.