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Thursday, November 6, 2008 - 11:20 AM

Yield enhancement using a combination of wafer level Failure Analysis and defect isolation software: case studies

P. Simon, M. Thétiot, B. Picart, ATMEL, ROUSSET, France; C. Kardach, H. Deslandes, DCG Systems, Fremont, CA; F. Dudkiewicz, Credence Systems Corporation, Milpitas, CA

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Summary: This publication aims at showing how EMMI and OBIRCH analyses can be improved by software tools like a layout viewer with net tracing capability and CAD overlay. The methodology, introduced in the three case studies, proves that the major failure mode can be known quickly thanks to his defect mode and can be located accurately before the physical analysis.