In the past decade and a half, Focused ion Beam systems ((FIB) have revolutionized sample preparation in the Microelectronics characterization and failure analysis domain. With submicron accuracy and stress free sections in hard to reach areas, FIB systems have become an indispensable tool in this regard. This tutorial will focus on sample preparation for Scanning and Transmission electron microscopy (SEM/TEM), used for Microelectronics characterization and failure analysis. Different strategies to prepare TEM samples using various Lift out techniques will be discussed, giving the user a broad perspective to make a choice on which tools are available, and make an educated choice in that regard. Materials covered will include Silicon based IC's as well as exotic (InP, GaAs etc.) materials.