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| Session 12: Sample Preparation II | ||||
| Location: Meeting Room E145 (Oregon Convention Center ) | ||||
| (Please check final room assignments on-site). | ||||
| Session Description: | ||||
| Session Chair: | Ms. Efrat Raz-Moyal Gatan, CA | |||
| 3:00 PM | Single Die 'Hands-Free' Layer-by-Layer Mechanical Deprocessing for Reverse Engineering | |||
| 3:25 PM | Characterisation and failure analysis of wafer-bonded devices and unfilled Through-Silicon-Vias (TSVs) | |||
| 3:50 PM | Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages | |||